ESD glossary

See here for key information relating toESD, EPA and electrostatic charges.

Discharge resistance:
Measurement with a megger between a grounding point and the electrode on a surface.

Antistatic:
“Charge-reducing quality”; can be a special type of plastic, for example.

BGA:
Stands for “Ball Grid Array”, denoting a special housing design.

CEM:
Stands for “Contract Electronics Manufacturing”.

Dissipative:
Surface resistance of materials which are between 105 and 1012 ohms.

DIP:
Stands for “Dual-in-Line Package”, denoting a special housing design.

What reduces electrostatic charges (assuming the task being performed remains the same)?
Increasing the relative humidity from 20% to 50%.

Electronics production:
Branch of industrial manufacturing that has specialised in the construction and assembly of electronic equipment. Electronics production typically entails tasks such as soldering individual components and assemblies, assembling circuit boards with electronic assemblies to form modules, and manufacturing complete devices/appliances such as computers and measuring devices. Electronics production also involves testing and checking electronic assemblies, modules and devices.

E2MS:
Stands for “Electronic Engineering and Manufacturing Services”, referring to electronics production service providers that not only assemble but also develop modules and complete products.

EPA:
Stands for “Electrostatic Protected Area”, denoting a work area in which you can handle assemblies that are sensitive to electrostatic influence without damaging them.

EOL:
Stands for “End of Line”, referring to the end of a production line, e.g. testing or quality assurance.

Grounding:
Dissipation of electrical currents into the ground.

Grounding point (EBP):
Central point (e.g. on a worktop) which is connected to the building’s grounding.

ESD:
Stands for “Electrostatic Discharge”.

ESDS:
Stands for “Electrostatic Discharge Sensitive Devices” and refers to electrostatically sensitive assemblies such as ICs

Fiducials:
Refers to the pattern recognition marks, position marks or marker points required in production systems in order to automatically position components for assembly or soldering.

IC:
Stands for “Integrated Circuit”, used for things like microchips, e.g. microprocessors.

Ionising:
Removing charged particles (e.g. electrons) from a substance such as air. Ionisers can neutralise electrostatic charges by distributing ionised air.

Insulator:
Materials that have a high surface resistance of at least 1012 ohms. Static charges remain in one area of this material for a long time without being dissipated (plastics, glass, air).

Cable harness:
Informal term for bundles of individual cables that transmit information signals or electric currents. The bundles are combined using cable ties or clamps or in conduits or ducts. Cable harnesses are generally made to suit specific functional, electrical and geometric requirements.

Cable assembly:
Describes the process of manufacturing cables that are ready to install, incl. cable harnesses and cable bundles along with plugs and contacts. Assembled cable bundles, cables and lines are used for mass production of machines and devices in various industries, e.g. the automotive industry.

Capacitor:
Passive electronic assembly for storing energy.

Circuit boards:
Circuit boards, also known as Printed Circuit Boards (PCBs), are part of electronic equipment and used as a mechanical platform for assembling and connecting electronic components.

(El.) conductivity:
Describes the property of a material to conduct electrical current, e.g. on metals.

Soldering:
Thermal method for firmly joining materials together. A liquid phase is created by melting a solder (melted soldering) or by diffusion on the adjoining surfaces (diffusion soldering). This connection cannot be undone.

Microelectronics:
Branch of electrical engineering where electronic circuits (resistors, capacitors and transistors) are located on a common substrate and produced in a standardised manufacturing process.

Sample production:
Describes the production of one or a small number of circuit board prototypes.

Multi-layer circuit boards:
Circuit boards or PCBs that have several layers. Due to the fact that electronic components are becoming ever-smaller and the packing density is increasing, even double-sided circuit board coatings are no longer sufficient to create complex circuits.

Standards:
IEC 61340-5-1: Protection of electronic devices from electrostatic phenomena - General requirements IEC 61340-5-2: Protection of electronic devices from electrostatic phenomena - User guide IEC 61340-4-1: Electrical resistance of floor coverings and installed floors ANSI/ESD S20.20.-1999: Protection of Electrical and Electronic Parts, Assemblies and Equipment, USA (available free of charge on the internet) ANSI/ESD S541-2003: Packaging Materials for ESD Sensitive Items, USA

Surface resistance:
Resistance between two points on a surface which can be measured using a megger and two electrodes.

SMD:
Stands for “Surface Mounted Device”.

SMT:
Stands for “Surface Mounting Technology”.

SMD assembly:
Describes the process of attaching and soldering components such as resistors or capacitors directly onto a circuit board using soldering pads.

Current:
Unit [A] ampere, symbol: I, flow of (usually negative) charge carriers.

Voltage:
Unit [V] volt, symbol: U, maintains the electrical current in a closed circuit, therefore the cause of the current flow.

Coil:
A coil is a passive device for generating inductance.

Volt: at what point does an ESD event (flying spark) become perceptible or noticeable?
3000 V (HBM), e.g. when a person discharges a charge upon touching a door handle 3,000 volts (HBM)

Thermal paste:
Surface unevenness that remains following assembly work causes air to become entrapped, which can lead to heat pockets or hot spots. Thermal paste is applied before starting assembly work in order to compensate for this unevenness and improve the thermal conductivity at the transition between the heat-producing component and heat sink.

Resistance:
Unit [Ω] ohm, symbol: R, indicates the voltage required to allow a specific current flow through an electrical conductor.

What causes electrostatic charge (net charge)?
An imbalance in electrons

Apart from the HBM (a charged person), which discharge model is considered very critical?
CDM = components are charged and the charge is discharged via potential equalisation

Why is equipment in an Electrostatic Protected Area (EPA) grounded?
To prevent differences in potential with modules that are sensitive to ESD

Which ESD equipment requires a dissipative ESD floor?
ESD chair, ESD shoes and ESD transport trolley

How often should you check that the wristband system and your ESD shoes are working properly?
If used daily: each time before starting work.

What can encourage the build-up of charges?
Clothingandpeople: synthetic materials, fleece pullover, non-ESD coats, non-ESD shoes, hair.Surfaces: waxed, painted, varnished surfaces, carpet, acrylic, vinyl, plastic glassChairs: all non-ESD chairsPackaging: plastic bags and containers, foam, polystyrene.Tools: pressurised sprays, compressed air, brushes, blowers, printers, monitors

ZVEI
Acronym for the “Zentralverband Elektrotechnik- und Elektronikindustrie e.V.” (German Electro and Digital Industry Association)

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